Small diamond cutting machine
CYSI CY-DWC-M404 small diamond wire cutting machine with reciprocating wire mode, ±10μm accuracy, programmable continuous feed, and adaptive tension for slicing silicon, sapphire, gems, and hard brittle materials.
The CYSI CY-DWC-M404 Small Diamond Wire Cutting Machine features a single-line reciprocating wire mode that maximises cutting efficiency while protecting wire integrity through adaptive tension control. Fully programmable continuous feed and a direct motor drive deliver consistent ±10μm dimensional accuracy, making this system ideal for slicing silicon, sapphire, ceramics, gemstones, and graphite electrodes with superior surface finish and minimal material waste.
Specifications
| Parameter | Value / Details |
|---|---|
| Product Model | CY-DWC-M404 |
| Spindle Speed | 2–260 rpm (adjustable) |
| Cutting Line Length | 20 m |
| Guide Wheel Inner Distance | 100 mm |
| Y-Axis Travel | ≤ 50 mm |
| Z-Axis Travel | ≤ 60 mm |
| Max Sample Size | Ø50 mm × 50 mm |
| Cut Accuracy | ±10 μm |
| Dimensions | 510 × 500 × 1099 mm |
| Weight | 50 kg |
| Applications | Silicon, sapphire, alumina, ceramics, gems, graphite electrodes |
Trade Information
| Trade Detail | Information |
|---|---|
| Minimum Order Quantity | 1 Unit |
| Supply Ability | 4 Units Per Month |
| Delivery Time | 1–16 Weeks |
| Main Domestic Market | China |
| Export Markets | Worldwide |
| Payment Terms | T/T, L/C, Western Union, PayPal |
| Packaging | Wooden crate with foam-padded export packing |
| Warranty | 12 Months from date of commissioning |
| After-Sales Service | Online technical support + on-site service available |
| Customization | Available on request |
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