CYSI fully automatic diamond wire cutting machine with CNC-controlled feed, multi-axis cutting, and continuous unattended operation for high-precision slicing of silicon, sapphire, SiC, and crystal materials.
The CYSI Fully Automatic Diamond Wire Cutting Machine enables unattended precision slicing of silicon ingots, sapphire boules, SiC crystals, and other hard brittle materials. CNC-controlled feed axis, automatic wire tension management, and programmable multi-cycle operation deliver consistent cut quality and wafer thickness accuracy, dramatically improving throughput and yield compared to manual cutting methods.
| Parameter | Value / Details |
|---|---|
| Operation | Fully automatic CNC-controlled |
| Cutting Mode | Multi-cycle automatic with unattended operation |
| Wire Tension | Automatic adaptive tension management |
| Applicable Materials | Silicon, sapphire, SiC, crystals, ceramics, composites |
| Cut Accuracy | High precision — consistent wafer thickness |
| Axes | Multi-axis programmable feed |
| Applications | Semiconductor wafer slicing, crystal substrate preparation |
| Trade Detail | Information |
|---|---|
| Minimum Order Quantity | 1 Unit |
| Supply Ability | 4 Units Per Month |
| Delivery Time | 1–16 Weeks |
| Main Domestic Market | China |
| Export Markets | Worldwide |
| Payment Terms | T/T, L/C, Western Union, PayPal |
| Packaging | Wooden crate with foam-padded export packing |
| Warranty | 12 Months from date of commissioning |
| After-Sales Service | Online technical support + on-site service available |
| Customization | Available on request |
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