CYSI CY-DWC-C202 circular precision diamond wire cutting machine with gravity feed, micrometer positioning, and 3.9 m/s linear speed for damage-free cutting of crystals, ceramics, sapphire, and brittle materials.
The CYSI CY-DWC-C202 Circular Precision Diamond Wire Cutting Machine uses a circulating diamond wire with gravity feed for damage-free slicing of fragile, brittle, and small-volume materials including ceramics, crystals, glass, metals, thermoelectric and infrared optical materials. Manual micrometer feed control and a two-dimensional rotating fixture provide precise sample positioning for accurate, repeatable cuts with minimal kerf loss.
| Parameter | Value / Details |
|---|---|
| Product Model | CY-DWC-C202 |
| Max Linear Speed | 3.9 m/s |
| Cutting Line | Circular diamond wire (~840 mm) |
| Max Cutting Size | 52 mm |
| Wire Diameter | Ø 0.42 mm |
| Z-Axis Feed | Gravity feed |
| Y-Axis Feed | Manual micrometer |
| Dimensions | 761 × 295 × 373 mm |
| Weight | 25 kg |
| Applications | Crystals, ceramics, glass, sapphire, IR optical, thermoelectric materials |
| Trade Detail | Information |
|---|---|
| Minimum Order Quantity | 1 Unit |
| Supply Ability | 4 Units Per Month |
| Delivery Time | 1–16 Weeks |
| Main Domestic Market | China |
| Export Markets | Worldwide |
| Payment Terms | T/T, L/C, Western Union, PayPal |
| Packaging | Wooden crate with foam-padded export packing |
| Warranty | 12 Months from date of commissioning |
| After-Sales Service | Online technical support + on-site service available |
| Customization | Available on request |
Your email address will not be published. Required fields are marked *
Please login to write review!
Looks like there are no reviews yet.
